How advanced packaging technologies enable next-gen computing | Lam Research posted on the topic | LinkedIn
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Assessing the opportunity and impact of advanced packaging innovation
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Addressing critical advanced packaging challenges in chipmaking
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In case you missed it — we launched VECTOR® TEOS 3D! This breakthrough deposition tool is engineered to address the advanced packaging demands of next-generation AI and high-performance computing (HPC) applications. If this is your first time hearing about VECTOR® TEOS 3D, here’s a quick rundown. ⬇️ 📖 Blog Post: https://newsroom.lamresearch.com/everything-you-need-to-know-about-vector-teos-3d 🗞️ Press Release: https://investor.lamresearch.com/2025-09-09-Lam-Research-Introduces-VECTOR-R-TEOS-3D
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Logic scaling packs billions more transistors into the same space, unlocking faster performance, higher efficiency, and new AI capabilities. Discover how our etch, deposition, and advanced patterning innovations make it possible. https://bit.ly/4nplc0W | Lam Research Corporation
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3.3K views · 62 reactions | Our cutting-edge advanced packaging technologies make High Bandwidth Memory (HBM) a reality for #GenAI devices. Discover why solutions like 2.5D and 3D integration are critical for enabling the third generation of HBM and providing high-speed access to vast data sets for #AI training. https://bit.ly/47ekrAC | Lam Research Corporation | Facebook
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1.8K views · 40 reactions | The semiconductor industry is bringing 3D advanced packaging concepts into production — are you ready? Discover how we ensure advanced packaging achieves commercial success. https://bit.ly/4dWuJYT | Lam Research Corporation | Facebook
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