Global demand for Chip-on-Wafer-on-Substrate (CoWoS) and CoWoS-like packaging capacity will likely grow by 113% annually in 2025, driven by robust demand for cloud AI accelerators, according to ...

One of the most amazing things that human civilization has created is the silicon chip, with semiconductor technology not just about the 'CPU' or the 'GPU' anymore... but rather advanced packaging ...

The world of AI chips hasn't stopped, and won't stop, with advanced packaging production capacity in short supply. TSMC's new CoWoS plant in Nanke Chiayi Park is entering the "environmental review ...

Taiwan Semiconductor Manufacturing Company (TSMC) remains the world's sole provider capable of delivering a complete end-to-end Chip-on-Wafer-on-Substrate (CoWoS) packaging solution. For Chinese ...

Nvidia Corp (NASDAQ:NVDA) plans to use Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips earlier than scheduled to address the production constraints of Chip on Wafer on ...

Against this backdrop, PrecisioNext's Loong series TC Bonder has achieved a historic first: completing CoWoS-L test sampling for domestic AI chips through close customer collaboration. This marks the ...

Demand for Nvidia's bleeding-edge Blackwell dual-die designs is reportedly overtaking Nvidia's lower-end single-die designs. TF International Securities analyst Ming-Chi Kuo from Medium reports that ...

In the largest single foreign investment in US history, Taiwan Semiconductor Manufacturing Company has unveiled a $100 billion investment, drawing global attention and prompting concern in Taiwan.

TSMC has declared that its sophisticated packaging capacity is booked out for two years after Nvidia, AMD, and Guanghuida have secured its state-of-the-art packaging technologies for their ...