Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...

How the challenges of electric-motor control design can be overcome using digital twins in all design and test phases. How automated testing within a continuous and integrated toolchain is able to ...

Final electrical test remains one of the best ways to assess a circuit’s ultimate viability. But we know that, unfortunately, even 100% end-of-line electrical testing of semiconductor wafers will not ...