Xerox Corp.'s Palo Alto Research Center (PARC) has developed a technique for creating self-assembling 3-D structures on IC substrates. PARC has demonstrated the technique by creating out-of-plane ...

While semiconductor lithography gets the bulk of the attention in chipmaking, other processes are equally important in producing working integrated circuits (ICs). Case in point: packaging. An IC ...

Kinsus Interconnect Technology will strive to grow its business in the FCBGA and AiP packaging fields this year seeking to better cash in on new business opportunities arising from... Unimicron ...

New portfolio drives chip performance with panel-based interconnect innovation KLA is extending the capability of the proven Corus™ direct imaging platform and introducing the Serena™ direct imaging ...

SEOUL, Dec. 10 (Yonhap) -- LG Innotek Co., a major South Korean electronics parts maker, has developed a next-generation smart integrated circuit (IC) substrate that cuts carbon emissions during the ...

The semiconductor is a highly integrated device that cannot be connected directly to the main board in the way that condensers or resistors can. Therefore, a packaging substrate (or intermediary layer ...

LG Innotek has developed a next-generation smart IC (integrated circuit) substrate, a core component in smart cards, that requires no metal plating. The breakthrough ...

Substrate suppliers are slashing capacity allocated to wirebond IC substrates. We hear about “limited tenting capacity,” “no support for EBS designs,” and requests for “conversion to etchback” designs ...

LG Innotek said on the 10th that it has developed a "next-generation smart integrated circuit (IC) substrate" that boosts performance while cutting carbon emissions to half of previous levels. It is ...