Researchers have developed a stacking technology for a magneto-resistive random access memory (MRAM) to separately form a single-crystal tunnel magnetoresistive (TMR) thin film and then bond it to a ...
Advanced packaging can be an alphabet soup of possible approaches, from heterogenous integration of multiple die types into a single package, to three-dimensional stacking of multiple dies on top of ...
Researchers from Pohang University of Science and Technology (POSTECH) and the University of Montpellier have successfully synthesized wafer-scale hexagonal boron nitride (hBN) exhibiting an ...
An MIT research team has described a first technique for stacking layers of block copolymer wires in such a way that the wires in one layer orient themselves perpendicularly to those in the layer ...
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