TL;DR: AMD's Ryzen 7 9800X3D processor features a thick dummy silicon layer, using 93% of the CCD stack, which is non-functional but necessary for stability. The 3D chiplet is now positioned ...
IBM and one of its partners have figured out how to bond two silicon wafers together without requiring a glass carrier, theoretically simplifying the entire process. Share on Facebook (opens in a new ...
AMD has better detailed its next-gen 3D V-Cache stacking technology, where at the exciting but all-digital Hot Chips 33 symposium the company teased its current, and even future 3D stacking ...
Morning Overview on MSN
MIT’s chip stacking leap could slash energy use for hungry AI chips
Artificial intelligence is colliding with a hard physical limit: the energy it takes to move data on and off chips. Training ...
Forward-looking: 3D chip stacking technology has yet to arrive in a big way, with only Intel Foveros reaching the market in Lakefield CPUs, and some Zen3-with-vertically-stacked-cache products waiting ...
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