1. The OSD335x is an example of a complete system fitting into a tiny BGA package. We also discussed the advantages SiP brings to the design and manufacturing of semiconductors and how they can be ...

The OSD335x C-SiP hits the size and performance sweet spot for a wide range of applications, from building automation to industrial control to consumer goods, and it’s going to be especially popular ...

System-in-package (SiP) technology is at the beginning of its revolution. Some see the SiP in the same way as a system on chip (SoC)—as an IC component with no simple path to further customization.

At Embedded World North America, Octavo Systems co-founder Gene Frantz and CTO Erik Welsh discussed the company’s focus on system-in-package (SiP) technologies and their role in embedded systems.

The OSD32MP1 SiP integrates over 120 components, including a STM32MP1 multicore processor, a PMIC, DDR3 memory, and MEMs oscillators in a 18 × 18-mm package A couple of days ago, STMicroelectronics ...

At Embedded World today, Insight SiP, the specialist in ultra-miniature RF modules, is launching the ISP4520 series of modules, extending its product portfolio to include Long Range Networking via ...