1. The OSD335x is an example of a complete system fitting into a tiny BGA package. We also discussed the advantages SiP brings to the design and manufacturing of semiconductors and how they can be ...

The challenge of SIPs goes beyond what it takes to assemble them. Increasing functionality and performance in ICs have driven manufacturers to work with wider and more challenging packaging solutions.

The IoT represents a rapidly growing market for which high-speed wireless connections suitable for various usage systems are indispensable. The arrival of digital transportation is accelerating this ...

Pune, India, Nov. 07, 2023 (GLOBE NEWSWIRE) -- Advent of 5G network in global market created lucrative opportunity for the market player to develop new line of electronics devices, having ...

Intuitively, a design team’s use of on-chip integration and in-package integration ought to be a matter of system partitioning—a question decided wholly on issues such as the functional and process ...

For many years, system-in-package (SiP) technology has been a focus for semiconductor packaging to address the ongoing market trend of system integration and size reduction. Today’s increased ...

Hsinchu, Taiwan -- Mar. 23, 2009-- Giga Solution Tech. (TW:3559), the only professional test service corporation focusing on RFIC/SiP/SoC test area, and Global Unichip Corp. (GUC; TW:3443), the ...

GAITHERSBURG, Md., Feb. 26, 2024 (GLOBE NEWSWIRE) -- GL Communications Inc., a global leader in telecom test and measurement solutions, addressed the press regarding their SIP protocol emulation and ...

MEMS and sensor devices have catapulted the Internet of Things (IoT) toward the deployment of billions of sensors in a myriad of applications in electronics technology that will improve the world ...

Keeping pace with Moore’s law continues to be challenging and is driving adoption of innovative packaging technologies that support continued system scaling while doing so at lower costs than ...