TEMPE, AZ--(Marketwire - Oct 22, 2012) - EPEPS -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced enhancements to its Allegro ® 16.6 ...

Westford,USA, July 25, 2023 (GLOBE NEWSWIRE) -- According to SkyQuest, the system in package (Sip) technology market is expected to witness significant growth, driven by several factors. The increased ...

System-in-a-package technology fulfills the need for high-density, small-footprint products with short turnaround times by using low-cost, standard assembly equipment. Shorter development times and ...

The system-on-chip (SoC) is arguably the biggest misnomer of today’s electronics industry. The core integrated circuit may well have onboard much of the logic circuitry needed to support the needs of ...

The semiconductor industry’s push toward continued miniaturization and increasing complexity is driving wider adoption of system-in-package (SiP) technology. One of the big benefits of SiP is that it ...

Path to Systems - No 3: This article provides insights into how the design and manufacturing process of system-in-package technology will extend Moore’s vision, creating Moore’s law 2.0.

Infineon Technologies, together with 40 European research partners, has successfully completed a €35million project to develop smaller, more integrated System-in-Package (SiP) solutions. The ESiP ...

The impatient and hungry mobile electronics market is fueling the need for system packaging technologies as an interim solution before the inevitable transition to system-on-chip methodologies. While ...

LONDON--(BUSINESS WIRE)--Technavio analysts forecast the global system-in-package (SiP) market to grow at a CAGR of above 10% during the forecast period, according to their latest report. The research ...

US-based Master Electronics has added RF modules to its offering with the signing of French RF module specialist, Insight SIP. The distributor is based in Phoenix, Arizona but ships worldwide as ...