Building an integrated circuit (IC) requires various physical and chemical processes to be performed on a semiconductor (e.g., silicon) substrate. Millions of transistors can be fabricated and wired ...

To help chipmakers conquer the time-to-market yield challenges of 45nm chip manufacturing, including the ones associated with immersion lithography, KLA-Tencor Inc. is launching a new overlay ...

Improving on product overlay is one of the key challenges when shrinking technology nodes in semiconductor manufacturing. . . . With smart placement of alignment mark pairs in the X and Y direction, ...

EUV lithography is creating a new set of challenges on the photomask side for which there currently are no simple solutions. While lithography is viewed as a single technology, EUV actually is a ...

(MENAFN- PR Newswire) The EVG40 D2W can be used for any D2W bonding application, including chiplet integration, high-bandwidth memory (HBM) stacks, and 3D system on chip (SoC) integration processes, ...

WILMINGTON, Mass.--(BUSINESS WIRE)--Onto Innovation Inc. (NYSE: ONTO) today announced that it has acquired Inspectrology, LLC. Headquartered in Sudbury, Massachusetts, USA, Inspectrology is a leading ...

TOKYO--(BUSINESS WIRE)--Nikon Corporation introduces the NSR-S631E ArF immersion scanner, ensuring world-class device patterning and optimum fab productivity to fully satisfy real-world 7 nm node ...

Yuliangsheng should be able to produce the first lithography system prototypes that are suitable for chips with structure widths of 28 to 7 nanometers: 28 nm chips are therefore possible with single ...