Qorvo, Inc. has launched three new highly integrated RF multi-chip modules (MCMs) designed for advanced radar applications. Leveraging Qorvo’s advanced packaging and process technology, the QPF5001, ...

Built 70% smaller than its predecessor, the ROK104001 Bluetooth multi-chip module has been developed to speed time-to-market by enabling designers to quickly implement qualified and tested Bluetooth ...

Addressing the need for higher frequency and current in dc/dc converters, the TB7001FL multi-chip module combines a high side MOSFET, a MOSBD to handle low-side functions, and a driver IC that ...

Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...

Multi-chip module (MCM) graphics cards just might be the future, bringing upcoming generations of GPUs to a whole new level. Combining multiple dies instead of relying on a single chip could provide ...

For high performance applications, demand for highly integrated packages has increased. This is due to the highly integrated package’s electrical performance advantages of reduction of interchip ...

TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...

ELMSFORD, N.Y.--(BUSINESS WIRE)--SEEQC, the digital quantum computing company, today introduced a family of high speed, energy-efficient Single Flux Quantum (SFQ) digital chips capable of running all ...

The higher-bandwidth, lower-latency and higher-reliability requirements of 5G mobile networks drive the need for higher-performance, higher-efficiency and lower-power–consumption 5G chips and modules.

Historically, GPUs have been designed as monolithic dies with all of their functionality under one 'roof.' This hasn't always been the case -- the earliest GPUs sometimes used separate chips for ...