The anti-counterfeit taggant inks market is strategically positioned at the intersection of security, technology, and ...

Most of us use our cell phones, smart watches and other electronic devices without giving much thought to the components and how they fit and work together. But it’s a complex problem that ...

Flexible hybrid electronics (FHE) has spawned the development of novel packaging techniques to overcome the application limitations of the rigid boards, high-temperature solders, bulky component ...

In an era of collapsing economies, waning affluence, and too much garbage amid scarcity, a characteristic that is part of the engineering character – resourcefulness – is due to come back in vogue, as ...

A technical paper titled “Substrate Embedded Power Electronics Packaging for Silicon Carbide MOSFETs” was published by researchers at University of Cambridge, University of Warwick, Chongqing ...

Electronic packaging encapsulates intricate systems whose reliability is critically affected by moisture diffusion and the resultant delamination at material interfaces. As water molecules permeate ...

In today’s fast-paced world, high-value electronics—such as smartphones, laptops, gaming consoles, and medical devices—are an essential part of daily life and business operations. These items are not ...

Dr. Navid Asadi’s group examines chip packaging methods such as system-in-package (SIP). This is the second of a mutlipart series on chip packaging technologies. Peter (Chengjie) Xi is currently a ...

Earlier this year, we published a couple of articles on the matter of electronic packaging waste in the AV technology industry. The first one examined it through the very narrow lens of an “AV Install ...

Electronic Vehicles (EVs) have been at the center of attention in recent years. With the automotive industry becoming more aligned with sustainable development goals, the focus has shifted toward EVs ...

As microelectromechanical-systems (MEMS) ICs satisfy more functions and proliferate, packaging them into high-density form factors like 3D becomes more of a challenge than conventional ICs. To ...

Packaging Science research focuses on a range of societal challenges including sustainability, food safety, and supply chain security. This research area addresses the need to develop and adopt ...