TL;DR: TSMC plans to increase prices for its 5nm and 3nm process nodes by 5-10% and CoWoS advanced packaging by 15-20% due to high AI demand. These price hikes are expected in January 2025. The 3nm ...

TSMC's CoWoS-L is the latest CoWoS process variant, and is expected to kick off commercial production in 2023-2024, according to industry sources. The offering is designed to target AI-specific ...

Advanced packaging has emerged as the centerpiece of semiconductor innovation, with industry attention now focused on what will replace the dominant chip-on-wafer-on-substrate (CoWoS) process. Many ...

One of the most amazing things that human civilization has created is the silicon chip, with semiconductor technology not just about the 'CPU' or the 'GPU' anymore... but rather advanced packaging ...

TSMC’s (Taiwan Semiconductor) 2.5D advanced packaging CoWoS (Chip on wafer and wafer on substrate) technology is currently the primary technology used for AI chips. The production capacity of CoWoS ...

Despite market speculation of a major reduction in Nvidia Corporation's (NASDAQ:NVDA) 2025 Chip-On-Wafer-On-Substrate (CoWoS) wafer orders at Taiwan Semiconductor Manufacturing Co (NYSE:TSM), renowned ...