TOKYO--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today announced that it has delivered the industry’s first complete memory ...

The use of memory-heavy IP in SoCs for automotive, artificial intelligence (AI), and processor applications is steadily increasing. However, these memory-heavy IP often have only a single access point ...

Why a new memory interface is needed. Features and benefits of DDR5. How DDR5 will usher in a new era of composable, scalable data centers. The move to DDR5 will probably be more important than most ...

System architects are often impatient about the future, especially when they can see something good coming down the pike. And thus, we can expect a certain amount of healthy and excited frustration ...

The new NVIDIA Grace Hopper Superchip has been designed for giant-scale AI and HPC (high-performance computing) use, we have NVIDIA's in-house Grace CPU + Hopper GPU combo, with an insane 600GB of GPU ...

What is the most expensive component that hyperscalers and cloud builders put into their X86 servers? It is the GPU accelerator, correct. So let’s ask this question another way: What is the most ...

Momentum for sharing memory resources between processor cores is growing inside of data centers, where the explosion in data is driving the need to be able to scale memory up and down in a way that ...

High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...