Patchy particles are formed from the clusters using a two-stage swelling process followed by polymerization 31. First, a low-molecular-mass, water-insoluble organic compound (1-chlorodecane) is ...

A highly versatile deposition process already used to manufacture aircraft parts and other expensive, delicate surfaces is now 3-D modeled to show the effects of temperature for the first time. Cold ...

New research reveals the best way to make metal particles stick to a surface in a spray-coating process. Surprisingly, melting hurts rather than helps. When bonding two pieces of metal, either the ...

Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...