As Micro-LED displays and advanced semiconductor components push the limits of miniaturization and efficiency, precision and scalability in manufacturing become critical. The technology-leading ...

ST. FLORIAN, Austria, July 12 /PRNewswire/–EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it ...

Celeprint push throughput boundaries. Manufacturers prioritize hybrid solutions to tackle yield issues, while automotive giants integrate transparent screens. Future growth hinges on achieving ...

Bergquist sent me a sample of its Bond Ply 450 thermal interface material combined with its Thermal Clad metal substrate for LED assemblies. The peel-and-stick aspect of mounting an LED substrate is ...

- Contributing to realization and wide spread of implementation in vertical GaN power devices - GaN devices are attracting attention as next-generation devices that combine high device characteristics ...

Interposers and substrates are undergoing a profound transformation from intermediaries to engineered platforms responsible for power distribution, thermal management, high-density interconnects, and ...

2020 and 2021 are the years for mini-LED displays to grow. Electronics manufacturers all launched their product lines based on mini-LEDs. The popularity of backlit mini-LEDs paved the way for ...

TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703), in collaboration with Shin-Etsu Chemical Co., Ltd. (Head Office: Tokyo; President: Yasuhiko Saitoh; "Shin-Etsu Chemical"), has announced the successful ...