Japanese engineering plastics supplier Polyplastics has introduced an innovative plastics bonding technology that is said to be unlike traditional joining methods such as welding or adhesion. AKI-Lock ...

A review of the use of adhesives for device assembly, focusing on optical radiation curing using UV light. by B. G. Yacobi, Chris Le Conte, Kevin Davis, and Manfred Hubert New equipment, such as the ...

Hybrid bonding is gaining traction in advanced packaging because it offers the shortest vertical connection between dies of similar or different functionalities, as well as better thermal, electrical ...

Copper-copper bonding is emerging as a pivotal technology in three-dimensional integration, offering a viable pathway towards overcoming the limitations of traditional interconnect methods. By ...

A new type of 3D-printed adhesive could change how we join materials together. So far, scientists have developed two new methods that can create extremely strong bonds at the pore level, eliminating ...

Designed for nanometer-scale silicon ICs, a new wire-bond chip-packaging process–called Pad on I/O–by chip manufacturer LSI Logic (Milpitas, CA) places bond pads directly on active copper/low-K ...