Expands Advanced Packaging Platform Across Wafer-Level and Panel-Level Applications in Key Global Markets-FREMONT, Calif., Feb. 26, 2026 ...

AUSTIN, TX, UNITED STATES, February 26, 2026 /EINPresswire.com/ -- Electroninks, the leader in metal complex inks for ...

On May 29, 2025, Marvell Technology, Inc. (NASDAQ:MRVL) launched the latest addition to its IP portfolio of custom AI compute platforms, a multi-die packaging platform. This production-qualified ...

WICHITA, KS, UNITED STATES, February 15, 2026 /EINPresswire.com/ -- Nitride Global, Inc. (NGI), a global leader in ...

As the global semiconductor industry enters the post-Moore's Law era amid surging demand for artificial intelligence (AI) and high-performance computing (HPC), advanced packaging has become a critical ...

Great Lakes Semiconductor (GLS) and Advanced Printed Electronic Solutions (APES) have entered a strategic partnership to launch a new initiative focused on advanced semiconductor packaging and ...

CEO Michael Plisinski announced that Onto Innovation achieved a quarterly revenue record of $267 million, driven by growth in advanced nodes and packaging. This expansion supports AI compute engines ...

Nvidia Corporation is set to implement a new advanced packaging technology called Chip-on-Wafer-on-Platform PCB (CoWoP) for its next-generation GR150 AI GPU, expected to launch in 2027. This approach ...

GlobalFoundries (GF) has announced plans to build an Advanced Packaging and Photonics Center in the state of New York, USA. Describing the center as “the first of its kind,” the company said the new ...

In today's fast-changing technological landscape, two key theories determine the future of semiconductor design: Moore's Law and the More-than-Moore approach. While Moore's Law focuses on increasing ...